Evaluating the lifetime and reliability of a TFT in a stress test using gate voltage and temperature measurements

ABSTRACT

Time coefficient β, voltage coefficient d and temperature coefficient φ 0  of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under the same condition are obtained through experiment using -BT stress test, mean value μ and standard deviation σ of the threshold voltage shift amount are calculated by -BT stress test for a plurality of individual TFTs, and the life t of the individual TFT is evaluated by the expression. ##EQU1##

This application is a continuation-in-part of application Ser. No. 08/533,659 filed Sep. 25, 1995 now U.S. Pat. No. 5,608,338.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method of evaluating reliability of a TFT (Thin Film Transistor) and, more specifically, to a method of evaluating reliability of a TFT including a channel layer of silicon thin film and a gate insulating film of silicon oxide.

2. Description of the Background Art

In an SRAM (Static Random Access Memory) device, it is possible to retain data for a long period of time by using a battery. One of the important factors representing the performance of this device includes a so called "hold lower limit voltage". The hold lower limit voltage means the lower limit value of the voltage at which the data can be correctly held in the SRAM device.

FIG. 14 shows an example of an equivalent circuit of an SRAM cell. The SRAM cell includes a pair of storage nodes 10a and 10b; a pair of load transistors 11a and 11b; a pair of driver transistors 12a and 12b; a pair of access transistors 13a and 13b; a pair of bit lines 14a and 14b; and a pair of word lines 15a and 15b. More specifically, in the SRAM cell, data is stored by a flipflop including two driver transistors 12a and 12b as well as two load transistors 11a and 11b by maintaining one storage node at H (high) level and maintaining the other storage node at L (low) level.

Now, assume that the storage node 10a is at H level. Then, load transistor 11a is ON, while driver transistor 12a is OFF. In other words, the state in which storage node 10a is at the H level corresponds to the state in which ON current of load transistor 11a is larger than the OFF current of driver transistor 12a.

Recently, load transistors of the SRAM cells increasingly come to be manufactured by using TFTS. However, in an SRAM cell including a TFT load transistor, ON current of load TFT 11a gradually reduces while it is used retaining data for a long period of time, and eventually it becomes smaller than the OFF current of driver transistor 12a. As a result, data at the H level may possibly be erroneously replaced by L level. The problem causing such an error is referred to as "hold defect". In order to avoid hold defect in the SRAM cell, it is necessary to well understand the properties of the TFT in which ON current decreases during use over a long period of time.

When the SRAM cell holds data, the load TFT on the side of the storage node 10a which is at the H level, is at such a voltage state as shown in FIG. 15 (A). In FIG. 15(A), a reference character V_(s) represents source voltage, V_(D) represents drain voltage, V_(G) represents gate voltage and Vcc represents power supply voltage. The voltage state of the TFT shown in FIG. 15(A) is equivalent to the voltage state shown in FIG. 15(B). The voltage state of the TFT shown in FIG. 15(B) is referred to as "-BT stress state."

Degradation in the TFT characteristic caused by -BT stress is reported in detail by Maeda et al., in J. Appl. Phys., Vol. 76 (12), 1994, pp. 8160-8166. According to this article of Maeda et al., threshold voltage of the TFT shifts in the negative direction by the -BT stress, as shown in FIG. 16. More specifically, in FIG. 16, the abscissa represents gate voltage V_(G) while the ordinate represents drain current I_(D) in logarithmic scale. Curves 16A and 16B represent characteristics of TFT before and after -BT stress. The inventors of the present invention disclosed a method of accurately predicting an amount of shift of the threshold voltage of the TFT caused by -BT stress in Japanese Patent Laying-open No. 6-326315. If the amount of shift of the threshold voltage is predicted in accordance with the method disclosed in Japanese Patent Laying-Open No. 6-326315 and if initial threshold voltage of the TFT is set appropriately in advance, it is possible to provide an SRAM device which does not suffer from hold defect even after it holds data for a long period of time.

However, the channel layer of the TFT is formed of a polycrystalline silicon thin film, and therefore among a plurality of TFTs manufactured under the same manufacturing conditions, initial characteristics of the TFTs vary as shown in FIG. 17. In addition, characteristics after -BT stress also vary widely, because of vibration in density of crystal grain boundary in the channel layer. Therefore, in the SRAM device, there is a high possibility of hold defect after it holds data for a long period of time, unless the amount of shift of the threshold voltage of the TFT having worst performance after -BT stress is estimated.

Conventionally, a TFT having a polycrystalline silicon thin film of which crystal grain diameter is relatively small with respect to the channel length has been used in the SRAM. Therefore, variation in the characteristics of the TFTs such as shown in FIG. 17 is small. Therefore, estimation of the amount of shift of the threshold value in the TFTs in accordance with the method disclosed in the aforementioned Japanese Patent Laying-Open No. 6-326315 has been sufficient. However, in order to minimize the size of the TFT, channel length becomes shorter, while the crystal grain diameter of the polycrystalline thin film is made larger in order to increase drain current. Accordingly, variation of the grain boundary density of polycrystalline silicon in the channel layer becomes larger in the individual TFT, and variation in the characteristics of TFTs becomes innegligible. Variation in the characteristics of TFTs caused by the dimensional relation between the grain diameter of polycrystalline silicon and the channel length is described in detail by Noguchi in Jpn. J. Appl. Phy., Vol. 32, 1993, pp. L1584-L1587.

Now, -BT stress degradation of TFT characteristics is closely related to dangling bond density and ratio of hydrogenation of silicon atoms in a polycrystalline silicon thin film. The dangling bond density and the ratio of hydrogenation of a polycrystalline silicon film by itself can be measured by using an ESR (Electronic Spin Resonance) apparatus. However, the dangling bond density and the ratio of hydrogenation of a polycrystalline silicon film in a finished TFT cannot be measured by the ESR apparatus. Therefore, there is a strong demand for development of a method of easily estimating the dangling bond density and the ratio of hydrogenation in the polycrystalline silicon thin film in a finished TFT.

SUMMARY OF THE INVENTION

In view of the problems of the prior art described above, an object of the present invention is to provide a method of evaluating reliability of an individual TFT taking into consideration variation of characteristics of a plurality of TFTs manufactured under the same manufacturing conditions. Another object of the present invention is to provide a method of estimating the dangling bond density and the ratio of hydrogenation of silicon atoms in a polycrystalline silicon thin film, which has close relation to the reliability of the TFT, by utilizing -BT stress test.

A method of evaluating the reliability of a TFT according to a first aspect of the invention, in a TFT having a channel layer of a polycrystalline silicon thin film and a gate insulating film of a silicon oxide film manufactured under a prescribed manufacturing condition, evaluates the reliability of the TFT in the BT stress state in which the gate is supplied with an arbitrary negative constant voltage V_(G) and maintained at an arbitrary constant temperature T based on the following expressions: ##EQU2## where ΔV_(th) represents the threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under a prescribed manufacturing condition, t time, α time coefficient, q elementary electric charge, d voltage coefficient, k Boltzman constant, t_(ox) the thickness of the gate oxide film, φ₀ temperature coefficient, ΔV_(th)τ tolerant threshold voltage shift amount for the TFT, μ and σ mean value and standard deviation respectively of threshold voltage shift amounts of the plurality of TFTs manufactured under the prescribed manufacturing condition, m a constant, and β=1/α. The method includes the step of determining time coefficient α in expression (2a) based on the relation between threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test and time t; determining voltage coefficient d in expression (3a) based on the relation between gate voltage V_(G). and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests using different gate voltages V_(G) ; the step of determining temperature coefficient φ₀ in equation (4a) based on the relation between temperature T and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests at different temperatures T; determining proportional constant ##EQU3## in expression (5) obtained from the relation between expressions (2a), (3a) and (4a), by using determined time coefficient α, voltage coefficient d and temperature coefficient φ₀ ; and calculating life τ of a single TFT manufactured under the aforementioned prescribed manufacturing condition, by using expression (8) which is obtained by substituting ΔV_(th)τ /(1+m|σ/μ|) for ΔV_(th)τ, in expression (7) for calculating life τ₀ of the jumbo TFT, which expression is obtained by converting expression (5) based on the determined proportional constant c₂ and the tolerant threshold voltage shift amount ΔV_(th)τ, of the jumbo TFT.

A method of evaluating the reliability of a TFT according to a second aspect of the invention, in a TFT having a channel layer formed of a silicon thin film and a gate insulating film of silicon oxide film, evaluates the reliability of the TFT in the -BT stress state in which the gate is supplied with an arbitrary negative constant voltage VG and held at a predetermined constant temperature T based on the following expressions: ##EQU4## where ΔV_(th) represents the threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under a prescribed manufacturing condition, t time, α time coefficient, q elementary electric charge, d voltage coefficient, k Boltzman constant, t_(ox). the thickness of the gate oxide film, φ₀ temperature coefficient, ΔV_(th)τ tolerant threshold voltage shift amount for the TFT, μ and σ mean value and standard deviation, respectively, of the threshold voltage shift amounts of the plurality of TFTs manufactured under the aforementioned prescribed manufacturing condition, m a constant and β=1/α. The method includes the steps of determining time coefficient a in expression (2a) based on a relation between time t and threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test; determining voltage coefficient b in expression (3a) based on a relation between gate voltage V_(G) and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress test using different gate voltages; determining a proportional coefficient ##EQU5## by using determined time coefficient α and voltage coefficient d in expression (5b) obtained from the relation between expressions (2a) and (3a); and calculating life τ of a single TFT manufactured under the aforementioned prescribed manufacturing condition by using an expression (8b) obtained by substituting ΔV_(th)τ /(1+m|σ/μ|) for ΔV_(th)τ in expression (7) for calculating life τ₀ of the jumbo TFT which expression is obtained by converting expression (5b) from the determined proportional coefficient c₂ and the tolerant threshold voltage shift amount ΔV_(th)τ of the jumbo TFT.

A method evaluating reliability of a TFT in accordance with a third aspect of the present invention, in a TFT having a channel layer formed of polycrystalline silicon thin film and a gate insulating film of a silicon oxide film and manufactured under a prescribed manufacturing condition, evaluates the reliability of the TFT in the -BT stress state in which the gate is supplied with a predetermined negative constant voltage V_(G) and maintained at an arbitrary constant temperature T using the following expressions: ##EQU6## where ΔV_(th) represents threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under a prescribed manufacturing condition, t time, α time coefficient, k Boltzman constant, φ_(E) temperature coefficient, ΔV_(th)τ tolerant threshold voltage shift amount of the TFT, μ and σ mean value and standard deviation, respectively, of threshold voltage shift amounts of the plurality of the TFTs manufactured under the aforementioned prescribed manufacturing condition, m a constant, and β=1/α. The method includes the steps of determining time coefficient α in equation (2a) based on the relation between time t and threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test; determining temperature coefficient φ_(E) in expression (4b) based on the relation between temperature T and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests at different temperatures T; determining proportional constant ##EQU7## using determined time coefficient α and temperature coefficient φ_(E) in expression (5c) obtained from the relation between expression (2a) and (4b); and calculating life τ of a single TFT manufactured under the aforementioned prescribed manufacturing condition by using expression (8d) obtained by substituting ΔV_(th)τ /(1+m|σ/μ|) for ΔV_(th)τ with respect to (7c) for calculating life τ₀ of jumbo TFT obtained by converting expression (5c) based on the determined proportional coefficient c₂ and tolerant threshold voltage shift amount ΔV_(th)τ of the TFT.

A method of evaluating reliability of a TFT in accordance with a fourth aspect of the present invention, in a TFT having a channel layer of a polycrystalline silicon thin film and a gate insulating film of a silicon oxide film and manufactured under a prescribed manufacturing condition, estimates dangling bond density N_(DB) and ratio of hydrogenation P_(H) of silicon atoms in the silicon thin film utilizing -BT stress test in which the gate is supplied with a predetermined negative constant voltage V_(G) and maintained at an arbitrary constant temperature T, using the following expressions: ##EQU8## where ΔV_(th) represents threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under the prescribed manufacturing condition, t time, a time coefficient, q elementary electric charge, d voltage coefficient, k Boltzman constant, t_(ox) thickness of the gate oxide film, φ₀ time coefficient, V_(th0i) and ΔV_(thi) initial threshold voltage and threshold voltage shift amount in a single TFT manufactured under the aforementioned prescribed manufacturing condition, V_(ths) initial threshold voltage of an SOI-MOSFET having the same size and shape as the TFT, m₁ and m₂ proportional constants, ξ degree of dissociation of Si--H coupling, C_(ox) capacitance of gate insulating film, n_(db) (x, ε) and p_(h) (x, ε) dangling bond density and ratio of hydrogenation, respectively, per unit energy and per unit volume at a position having energy potential ε with reference to an intrinsic Fermi level at a depth x from the surface of the channel layer, f (ε) Fermi distribution function, φ (x, φ_(s)) potential at position x when surface potential is φ_(s), t_(p) thickness of the polycrystalline silicon thin film, Δφ_(s) amount of change in surface of the TFT reaching the threshold voltage condition from flat band condition, and t_(s) a constant. The method includes the steps of determining time coefficient a in expression (2a) based on the relation between time t and the threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test; determining voltage coefficient d in expression (3a) based on the relation between gate voltage V_(G) and threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests using different gate voltages V_(G) ; determining temperature coefficient φ₀ in equation (4a) based on the relation between temperature T and threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests at different temperatures T; and calculating dangling bond density N_(DB) and ratio of hydrogenation P_(H) from expressions (9) to (13) using the determined time coefficient α, voltage coefficient d and temperature coefficient φ₀.

In the method of evaluating reliability of the TFT in accordance with a first aspect of the present invention, estimated life is evaluated by using time coefficient α, voltage coefficient d and temperature coefficient φ₀ determined from expressions (2a), (3a) and (4a) and -BT stress test and using expression (8) using mean value μ and standard deviation σ of the threshold voltages of the plurality of TFTs, predicted life of a single TFT used with an arbitrary constant gate voltage VG at an arbitrary constant temperature T can be easily evaluated with high reliability.

In the method of evaluating reliability of the TFT in accordance with the second aspect of the present invention, it is limited that TFT is used at a predetermined constant temperature. Therefore, predicted life of a single TFT can be evaluated without necessitating at least two -BT stress tests at different temperatures T.

In the method of evaluating reliability of the TFT in accordance with the third aspect of the present invention, it is limited that the TFT is used with a predetermined constant gate voltage V_(G), and therefore predicted life of a single TFT can be evaluated without necessitating at least two -BT stress tests using different gate voltages V_(G).

In the method of evaluating reliability of the TFT in accordance with the fourth aspect of the invention, dangling bond density and ratio of hydrogenation are calculated in accordance with expressions (9) to (13) using time coefficient α, voltage coefficient d and temperature coefficient φ₀ determined from expressions (2a), (3a) and (4a) and -BT stress test, and therefore dangling bond density and the ratio of hydrogenation in a polycrystalline silicon thin film after an arbitrary -BT stress test of a single TFT can be readily evaluated.

The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a graph showing relation between variation in initial threshold voltage V_(th0i) and variation in threshold voltage shift amount αV_(thi) caused by -BT stress in a plurality of TFTs manufactured under the same manufacturing condition.

FIG. 2 is an equivalent circuit diagram showing a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under the same manufacturing condition.

FIG. 3 is a graph showing relation between threshold voltage shift amount and time under -BT stress.

FIG. 4 is a graph showing relation between threshold voltage shift amount and the gate voltage in a -BT stress test.

FIG. 5 is a graph showing relation between threshold voltage shift amount and temperature in a -BT stress test. FIG. 6 is a flow chart showing the steps of the method of evaluating the TFT utilizing expression (8).

FIG. 7 is a flow chart showing steps for performing evaluation of the reliability of other TFTs easily, by utilizing result of the method of evaluating reliability shown in FIG. 6.

FIG. 8 is a flow chart showing the steps of the method for evaluating reliability of the TFT which is used only at a predetermined temperature.

FIG. 9 is a flow chart showing the steps of evaluating reliability of other TFTs easily, by utilizing the result obtained by the method of evaluating reliability shown in FIG. 8.

FIG. 10 is a flow chart showing the steps of the method of evaluating reliability of a TFT which is not used with a voltage other than a predetermined gate voltage.

FIG. 11 is a flow chart showing the steps of evaluating reliability of other TFTs easily, by utilizing the result obtained by the method of evaluating reliability shown in FIG. 10.

FIG. 12 is a graph schematically showing an energy band structure in a channel layer of a TFT.

FIG. 13 is a graph showing variations in dangling bond density and ratio of hydrogenation in a plurality of TFTs manufactured under the same manufacturing conditions.

FIG. 14 is an equivalent circuit diagram showing an example of SRAM cell.

FIG. 15 (A) and 15(B) are illustrated showing -BT stress state of a TFT in an SRAM cell.

FIG. 16 is a graph showing an example of shift in the threshold voltage caused by -BT stress in the TFT.

FIG. 17 is a graph showing variation in initial characteristics in a plurality of TFTs manufactured under the same manufacturing condition.

FIG. 18 shows apparatus for performing the calculations of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a graph showing a relation between variation in initial threshold voltage V_(th0i) and threshold voltage shift amount ΔV_(thi) caused by -BT stress among a plurality of TFTs manufactured under the same manufacturing condition. As is apparent from the graph, there is not an explicit correlation between the variation in the initial threshold voltage V_(th0i) and the variation in the threshold voltage shift amount ΔV_(thi) after -BT stress test. This is an important fact revealed for the first time through the experiments by the inventors.

If there is a relation that the higher the initial threshold voltage V_(th0i) of a TFT, the larger the threshold voltage shift amount ΔV_(thi) results after -BT stress, it would be necessary to investigate an SRAM cell including that TFT which has the highest initial threshold voltage V_(th0i), so as to ensure hold lower limit for holding data for a long period of time. However, there is not any correlation between the variation in the initial threshold voltage V_(th0i) and the variation of the threshold voltage shift amount ΔV_(thi) after -BT stress test. Thus, the inventors have found that what is necessary is to ensure hold lower limit without the necessity of considering initial threshold voltage V_(th0i), simply by studying mean value μ and standard deviation σ indicating variation, of the threshold voltage shift amount ΔV_(thi) after -BT stress test.

In the following, the method of evaluating reliability of an individual TFT among a plurality of TFTs manufactured under a prescribed manufacturing condition utilizing -BT stress test will be described.

Referring to FIG. 2, a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under the same manufacturing condition is prepared. The shift amount ΔV_(th) of the threshold voltage V_(th) when the jumbo TFT is held at an absolute temperature T with a gate voltage V_(G) for a time period t is represented by the following expression (1): ##EQU9## where α represents time coefficient, φ₀ temperature coefficient, d voltage coefficient, k Boltzman constant, q elementary electric charge and t_(ox) thickness of the gate insulating film.

The method of predicting the threshold voltage shift amount ΔV_(th) of the jumbo TFT caused by -BT stress test using the expression (1) above will be described in the following.

First, the temperature of the jumbo TFT is set, for example, to 125° C. which is the temperature at the -BT stress state. I_(D) -V_(G) characteristic is measured at that temperature, and the threshold voltage V_(th) of jumbo TFT is calculated. The threshold voltage at this time is referred to as initial threshold voltage V_(th0) Then, at the temperature T=125° C., source voltage V_(S) and drain voltage V_(D) are set to 0 V, and a negative voltage, for example, of -7 V is applied as the gate voltage V_(G). This state is referred to as -BT stress state, and the time at which application of the gate voltage starts is set to t=0.

After the lapse of a prescribed time period t, -BT stress state is released, and the threshold voltage at time t, that is, V_(th) (t) is measured. As soon as the measurement of threshold voltage V_(th) (t) is finished, jumbo TFT is returned to -BT stress state. By repeating measurement of the threshold voltage V_(th) (t), a graph such as shown in FIG. 3 can be obtained.

Referring to FIG. 3, the abscissa represents time (sec) while the ordinate represents the threshold voltage shift amount -ΔV_(th) (V). Here, the threshold voltage shift amount satisfies the relation ΔV_(th) =V_(th) (t)-V_(th0). Based on the graph of FIG. 3, time coefficient a in the following expression (2) can be determined.

    ΔV.sub.th =V.sub.1 t.sup.α                     (2)

where V₁, is proportional constant. The time coefficient α can be determined with higher accuracy as -BT stress time becomes longer. In the example shown in FIG. 3, the coefficient α=1/3 is obtained. Hereinafter, the process for calculating the time coefficient a will be referred to as process A.

Thereafter, in a jumbo TFT manufactured under the same condition, a -BT stress test is performed in which gate voltage different from that in process A. For example V_(G) is set to V_(G) =12 V, while the temperature is set to T=125° C., which is the same as that in process A. In accordance with the steps described in process A, the shift amount ΔV_(th) of the threshold voltage V_(th) is measured.

FIG. 4 is a graph showing the result of a plurality -BT stress test using different gate voltages V_(G) The abscissa represents gate voltage V_(G) (V), and the ordinate represents the threshold voltage shift amount -ΔV_(th) (V). The left circle in the graph represents the result of test where V_(G) was V_(G=) 7 V and the temperature was T=125° C., while the right circle represents the result of test where V_(G) was V_(G) =12 V and the temperature was T=125° C. Both of the test results indicate the states after the lapse of the same period of time t=t₀ after the start of the test. In the example of FIG. 4, the result when t₀ =10⁴ sec is shown. Based on this graph, the voltage coefficient d=3.8 Å can be obtained in the following equation (3), where V₂ represents proportional constant: ##EQU10##

Though gate voltages V_(G) of -V and -12 V were used in FIG. 4, the value of the voltage coefficient d can be calculated with higher precision through larger number of test using larger number of different gate voltages V_(G). In the plurality of tests for calculating the voltage coefficient d, the temperature used for the test must be constant. However, it may not be the same temperature as used in process A.

Hereinafter, the steps for calculating the voltage coefficient d will be referred to as process B. In expression (3) in process B, |V_(G) |/t_(ox) represents electric field, and therefore the voltage coefficient d may be considered as electric field coefficient. Alternatively d'=qd/2k may be considered as an electric field coefficient.

Further, in a jumbo TFT manufactured under the same manufacturing condition, -BT stress test is performed at a temperature different from that in the process A. For example, the temperature T=25° C. is used, and the gate voltage is set to the same value of V_(G) =-7 V as in process A. Under such condition, time change of the threshold voltage shift amount ΔV_(th) is measured through the same steps as described in process A.

FIG. 5 is a graph showing the result of measurement when T was T=125° C. and V_(G) was V_(G) =-7 V and the result of measurement when the temperature was T=25° C. and V_(G) was V_(G) =7 V. In this graph, the abscissa represents reciprocal number 1000/T (1/K) of temperature, while the ordinate represents the threshold voltage shift amount -ΔV_(th) (V). In the graph of FIG. 5 also, the results shown are the states after the lapse of time t₀ =10⁴ sec after the start of the test. The square on the left shows the result when T=125° C. and V_(G) =7 V, and the square on the right represents the result when T=25° C. and V_(G) =-7 V. Based on the voltage coefficient d obtained through process B and from FIG. 5, the temperature coefficient ¢0 in the following expression (4) can be obtained. ##EQU11## In the example of FIG. 5, qφ₀ =0.23 eV can be obtained. Hereinafter, the steps for calculating the temperature coefficient φ₀ will be referred to as process C.

In process C also, the value of temperature coefficient φ₀ can be calculated with higher accuracy through larger number of tests with various different temperature conditions. In the plurality of tests in process C, the test may be carried out using a gate voltage different from that in process A, provided that the gate voltage is constant.

The threshold voltage shift amount ΔV_(th) called by -BT stress in the jumbo TFT can be predicted in accordance with the expression (5) below through the above described three processes A, B and C: ##EQU12## where t₀ is 10⁴ sec in the above examples. However, it goes without saying that any other appropriate time can be set as the time t₀. Further, even when the value of t₀ differ in processes B and C, the threshold voltage shift amount ΔV_(th) can be calculated, as the time coefficient α is known.

Further, processes A, B and C may be performed in an arbitrary order. In the example above, the voltage coefficient d calculated through process B is utilized in process C. However, if the process C is performed earlier, the value φ_(e) defined by the following expression (6). ##EQU13## is calculated first, and then φ_(e) may be converted to φ₀ utilizing the voltage coefficient d calculated through process B.

By using expression (5), the threshold voltage shift amount ΔV_(th) after the lapse of a certain time period t under -BT stress state can be predicted. Alternatively, time τ₀ (life of jumbo TFT) until the threshold voltage shift amount ΔV_(th) reaches a certain tolerant value ΔV_(th)τ can be obtained. When expression (5) is solved by substituting ΔV_(th) =ΔV_(th)τ, and t=τ₀, the following expression (7) is obtained. ##EQU14## where β=1/α. In other words, by inputting the tolerant threshold voltage shift amount ΔV_(th)τ within which the jumbo TFT does not suffer from any functional problem, the gate voltage V_(G) used and the value of temperature T to expression (7), the life τ₀ of the jumbo TFT under -BT stress can be obtained.

Then, for an individual TFT among a plurality of TFTs manufactured under the same manufacturing condition as the plurality of TFTs in the jumbo TFT is subjected to -BT stress test. In this -BT stress test, the temperature, voltage, and the stress time may be set to such values that allow precise measurement of the threshold voltage shift amount ΔV_(thi) of the individual TFT. The threshold voltage shift amount ΔV_(thi) of the individual TFT is calculated from the difference in the threshold voltages before and after -BT stress test.

When we represent the number of individual TFTs used for measuring the threshold voltage shift amount ΔV_(thi) by n, the mean value μ and the standard deviation σ indicating the degree of variation of the threshold voltage shift amount ΔV_(thi) can be calculated in accordance with the following expressions. ##EQU15##

Therefore, the life τ of the individual TFT taking into consideration the variation of threshold voltage shift amount ΔV_(thi) can be calculated by using the expression (8), in which ΔV_(th)τ /(1+m|σ/μ|) substitutes for ΔV_(th)τ in expression (7): ##EQU16## where m is a factor designating strictness of the evaluation of the individual TFT, and a value around 3 may be used for m.

More specifically, the mean value μ and the standard deviation σ are calculated from the data obtained through measurement of variation in threshold voltage shift amount ΔV_(thi) in the individual TFTs shown in FIG. 1, and when these values are input to expression (8), the life of the SRAM device in consideration with the variation of TFT characteristics in the SRAM device can be obtained. Therefore, an SRAM device which is free from hold defect even after holding data for a long period of time can be obtained.

The method of evaluation of reliability described above may be also applied to a single crystal MOSFET.

FIG. 6 is a flow chart showing the steps of the method of evaluating reliability of an individual TFT in accordance with the expression (8) above. This figure may help visual understanding of the steps in the method of evaluating reliability of an individual TFT utilizing the expression (8).

An example of a modification of the above-described method of evaluating reliability will be described. When time coefficient α, voltage coefficient d, temperature coefficient φ₀ and proportional constant ##EQU17## related to the life of jumbo TFT (a) manufactured under a first manufacturing condition have been already calculated, life of a jumbo TFT (b) manufactured under a second manufacturing condition can be estimated in the following manner.

At least one -BT stress test is performed on the jumbo TFT (b), and the threshold voltage shift amount ΔV_(thb) at a certain time t₀ is obtained. The threshold voltage shift amount ΔV_(tha) of the jumbo TFT (a) under the same condition is also calculated. Since expression (5) has been determined with respect to jumbo TFT (a), the value ΔV_(tha) may be calculated through expression (5), or it may be calculated by actual measurement.

When the value ΔV_(thb) and the value ΔV_(tha) under the same condition are calculated, the threshold voltage shift amount and the life under an arbitrary condition of jumbo TFT (b) can be expressed as the following expressions (5a) and (7a) using the ratio of calculated values ΔV_(thb) and ΔV_(tha). Here, it should be noted that the coefficient β(=1/α), d and φ₀ used in expressions (5a) and (7a) are values related to jumbo TFT (a). ##EQU18##

Since coefficients β, d and φ₀ depend on the method of manufacturing the TFT, the life of the jumbo TFT (b) cannot be accurately estimated if jumbo TFT (a) is manufactured through considerably different steps of manufacturing the jumbo TFT (b). However, if the manufacturing method is not much different, the life of jumbo TFT (b) can be easily estimated from expression (7a), utilizing the expressions calculated for jumbo TFT (a). Since the time coefficient β can be obtained through one -BT stress test, more accurate life τ₀ of jumbo TFT (b) can be estimated when the time coefficient β of jumbo TFT (b) itself is used in expression (7a).

As in the embodiment of FIG. 10, by using the following expression (8a) in which ΔV_(th)τ /(1+|σ/μ|) substitutes for ΔV_(th)τ in expression (7a), life τ of an individual TFT (b) manufactured under the second manufacturing condition can be estimated: ##EQU19##

At this time, the mean value μ and the standard deviation a of the threshold voltage shift amount ΔV_(thi) of the individual TFT may be calculated by using an individual TFT (a), or they may be calculated by using an individual TFT (b). More specifically, when the mean value μ and standard deviation σ of ΔV_(thi) has been already calculated for TFT (a), then there is an advantage that the life of individual TFT (b) can be determined simply by performing one -BT stress test for jumbo TFT (b). Meanwhile, if the values μ and σ are calculated by using the individual TFT (b), the life of the individual TFT (b) can be determined with higher precision, as the information with respect to variation of TFT characteristic is obtained from the plurality of TFTs (b) themselves.

FIG. 7 is a flow chart illustrating the method of estimating life of an individual TFT easily by using expression (8a). This figure may help visual understanding of the method of estimating life of the individual TFT (b) manufactured under the second manufacturing condition, easily by utilizing the result of -BT stress test with respect to a TFT (a) manufactured under the first manufacturing condition.

If it is not necessary to predict life of the TFT at a temperature other than the predetermined temperature T₀, it is not necessary to calculate temperature coefficient φ₀ through process C described above. At this time, the threshold voltage shift amount ΔV_(th) and life τ₀ of the jumbo TFT can be calculated through expressions (5b) and (7b) below, while the life τ of the individual TFT can be calculated through the expression (8b): ##EQU20##

The steps for predicting life of an individual TFT utilizing the expression (8b) is illustrated in the flow of FIG. 8.

FIG. 9 is a flow chart showing the steps of the method of predicting life of another individual TFT (b), utilizing the result with respect to a TFT (a) obtained through the steps of FIG. 8. More specifically, by using the threshold voltage shift amounts ΔV_(tha) and ΔV_(thb) of jumbo TFT (a) and jumbo TFT (b) under the same condition, the life τ₀ of jumbo TFT (b) can be calculated by replacing ΔV_(th0) by ΔV_(th0) ·ΔV_(thb) /ΔV_(tha) in expression (7b), while the life τ of the individual TFT (b) can be calculated through the expression (8c): ##EQU21##

Further, if it is not necessary to predict life of the TFT at a voltage other than the predetermined gate voltage V_(G0) it is not necessary to calculate the voltage coefficient d through the above described process B. At that time, the threshold voltage shift amount ΔV_(th) and life τ₀ of the jumbo TFT can be calculated in accordance with the expressions (5c) and (7c) below, while the life τ of the individual TFT can be calculated through the expression (8d). ##EQU22##

The steps in the method of evaluating reliability of an individual TFT when it is not necessary to calculate voltage coefficient d is illustrated in the flow chart of FIG. 10.

FIG. 11 is a flow chart showing the steps of a method easily predicting life of another TFT (b) utilizing the results for a TFT (a) obtained through the steps of FIG. 10. More specifically, by using threshold voltage shift amount ΔV_(tha) and ΔV_(thb) of jumbo TFT (a) and jumbo TFT (b) under the same condition, the life τ₀ of jumbo TFT (b) can be calculated by replacing ΔV_(th0) by ΔV_(th0) ·ΔV_(thb) /ΔV_(tha) in expression (7c), and life τ of the individual TFT (b) can be calculated by the following expression (8e). ##EQU23##

Now, reliability of the TFT has close relation between the dangling bond density and the ratio of hydrogenation in the channel layer formed of polycrystalline silicon thin film, as already described. Therefore, a method of estimating the dangling bond density and the ratio of hydrogenation in an individual TFT utilizing -BT stress test will be described in the following.

The dangling bond density N_(DB) and the ratio of hydrogenation P_(H) in the TFT are represented by the expressions (9) and (10) respectively. ##EQU24## where m₁ and m₂ are proportional constants and V_(ths), represents threshold voltage of an SOI (Silicon On Insulator) type MOSFET (Metal Oxide Semiconductor Field Effect Transistor) having the same size and shape as the TFT.

Since the channel layer of the SOI-MOSFET is formed of a single crystal silicon, the threshold voltage V_(ths) can be calculated by known method separately. The threshold voltage V_(ths) obtained by the calculation can be corrected to more accurate value by using result of experiments on a capacitor having a capacitor insulating film manufactured under the same condition as the gate insulating film of the SOI-MOSFET.

FIG. 12 shows an example of an energy band structure in the channel layer of polycrystalline silicon in the TFT. In the graph of FIG. 12, the abscissa x represents depth from the surface (x=0) from the surface of the channel layer, and the ordinate ε represents energy potential level with reference to intrinsic Fermi level (ε=0). The reference character ε_(v) represents energy level of an upper limit of a valence band, ε_(c) represents energy level of a lower limit of a conduction band, ε_(F) represents actual Fermi energy level, and φ(x, φ_(s)) represents potential at position x when the surface potential of the channel layer is φ_(s).

The proportional constants m₁ and m₂ in expressions (9) and (10) can be calculated by the following expressions (11) and (12), taking into consideration the energy band structure such as shown in FIG. 12: ##EQU25## where ξ represents degree of dissociation of Si--H coupling caused by -BT stress, C_(ox). represents capacitance of gate insulating film, n_(db) (x, ε) and p_(h) (x, ε) represent dangling bond density and ratio of hydrogenation per unit energy and per unit volume at a position having potential ε and at a depth x from the channel surface, respectively, Δφ_(s) represents amount in change of the surface potential until TFT reaches the threshold voltage condition from flat band condition, and t_(p) represents thickness of the polycrystalline silicon film.

The degree of dissociation ξ of Si--H coupling in expression (11) can be represented by the following expression (13), where T represents temperature at the time of -BT stress and the stress electric field E is E=|V_(G) |/t_(ox) : ##EQU26## where the values φ and φ₀ in expression (13) can be calculated by utilizing -BT stress test using the jumbo TFT, as in the embodiment of FIG. 10. Therefore, the degree of dissociation ξ can be determined. As for the constant t_(s) in expression (13), it can be determined by the comparison of the dangling bond density N_(db) calculated in accordance with expressions (9), (11), (12), and (13) while leaving t_(s) unknown, with the dangling bond density N_(db) measured by the ESR apparatus for a single polycrystalline silicon thin film manufactured under the same condition on a polycrystalline silicon thin film incorporated in the TFT. Once the constant t_(s) is determined, the dangling bond density can be estimated in any TFT, since t_(s) is independent from the manufacturing condition of the TFT. One example of the value t_(s) obtained through experiment by the inventors was 5200 sec.

Now, if the value x is small, the values n_(db) (x, ε), p_(h) (x, ε) and φ (x, φ_(s)) are not dependent on the position, and assuming that there is not energy dependency in the band gap, the following expressions (14), (15) and (16) can be applied. Further, Fermi distribution function f(ε) can be approximated by the following expression (17): ##EQU27## where reference character E_(G) in expression (14) represents band gap, which corresponds to (ε_(c) -ε_(v)).

Therefore, by utilizing these approximation expressions (14) to (17), the expressions (11) and (12) for calculating proportional constants m₁ and m₂ can be simplified, as expressed by the following expressions (18) and (19): ##EQU28##

FIG. 13 shows the relation of the dangling bond density N_(DB) and the ratio of hydrogenation P_(H) of the individual TFT measured in FIG. 1 calculated through expressions (9), (10), and (13), (18) and (19).

The method of calculating the dangling bond density and the ratio of hydrogenation described above may also be applied for calculating the dangling bond density and the ratio of hydrogenation at an interface between the gate insulating film and the channel layer in a single crystal MOS transistor.

FIG. 18 shows apparatus for performing the calculations described in connection the present invention. The apparatus includes a standard computer arrangement 85 having a conventional central processing unit (CPU) (not shown), a random access memory (not shown), and a hard disk drive (not shown) each installed within housing 76, a display 78, a keyboard 80, a modem 74 for transmitting signals to/from the computer 85 over a telephone network (not shown), and a CD-ROM drive 72 into which a CD-ROM 70 can be inserted. CD-ROM 70 is one example of a machine-readable medium storing a machine executable software procedure for performing the calculations described in connection with the present invention. Other types of machine-readable media could be used for storing the machine executable software procedure such as the computer's floppy disk, a read only memory (ROM) chip, etc. Another medium for storing the machine executable software procedure is the computer's resident memory loaded from the hard disk or the floppy disk, a remote drive or ROM, or downloaded from a remote source over the telephone network via the modem 74 or on an ISDN line.

As described above, according to the present invention, life of a single TFT is predicted by utilizing -BT stress test. Therefore, an accurate and efficient method of evaluating reliability of a single TFT can be provided.

Further, according to the present invention, a method of evaluating the dangling bond density and the ratio of hydrogenation in a channel layer of polycrystalline silicon, which are closely related to the reliability of the TFT can be provided.

Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims. 

What is claimed is:
 1. A machine-readable medium storing a machine executable software procedure for evaluating the reliability of TFT in a -BT stress state, the TFT having a channel layer of a polycrystalline silicon thin film and a gate insulating film of a silicon oxide film manufactured under a prescribed manufacturing condition, and in the -BT stress state the gate is supplied with an arbitrary negative constant voltage V_(G) and maintained at an arbitrary constant temperature T based on the following expressions: ##EQU29## where ΔV_(th) represents threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under said prescribed manufacturing condition, t time, α time coefficient, q elementary electric charge, d voltage coefficient, k Boltzman constant, t_(ox) thickness of the gate oxide film, φ₀ temperature coefficient, ΔV_(th)τ tolerant threshold voltage shift amount for the TFT, μ and σ mean value and standard deviation, respectively, of threshold voltage shift amounts of the plurality of TFTs manufactured under said prescribed manufacturing condition, m a constant, and β=1/α, the machine executable software procedure comprising the steps ofdetermining time coefficient a in expression (2a) based on a relation between threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test and time t; determining voltage coefficient α in expression (3a) based on a relation between gate voltage V_(G) and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests using different gate voltages V_(G) ; determining temperature coefficient φ₀ in equation (4a) based on a relation between temperature T and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests at different temperatures T; determining proportional constant ##EQU30## in expression (5) obtained from a relation between expressions (2a), (3a) and (4a) , by using determined time coefficient α, voltage coefficient d and temperature coefficient φ₀ ; and calculating life τ of a single TFT manufactured under said prescribed manufacturing condition, by using expression (8) which is obtained by substituting ΔV_(th)τ /(1+m|σ/μ|) for ΔV_(th)τ in expression (7) for calculating life τ₀ of the jumbo TFT, which expression is obtained by converting expression (5) based on the determined proportional constant c₂ and the tolerant threshold voltage shift amount ΔV_(th)τ of the jumbo TFT.
 2. The machine-readable medium according to claim 1, wherein the machine executable software procedure further comprises the steps of:in -BT stress test for a TFT (a) manufactured under a first manufacturing condition and a TFT (b) manufactured under a second manufacturing condition, calculating threshold voltage shift amounts ΔV_(tha) and ΔV_(thb) of a jumbo TFT (a) and a jumbo TFT (b) under a condition where temperature T and gate electric field V_(G) /t_(ox) at a certain time point t are the same; replacing ΔV_(th0) in equation (7) calculated for said jumbo TFT (a) by ΔV_(th0) ·ΔV_(thb) /ΔV_(tha) and replacing ΔV_(th)τ by ΔV_(th)τ /(1+m|σ/μ|) by using mean value μ and standard deviation σ of the threshold voltage shift amount of either one of a plurality of said TFTs (a) and a plurality of said TFTs (b) to obtain an equation (8a) below: ##EQU31## and using the equation (8a), estimating life T of a single said TFT (b).
 3. A machine-readable medium storing a machine executable software procedure for evaluating the reliability of a TFT in a -BT stress state, the TFT having a channel layer formed of a silicon thin film and a gate insulating film of silicon oxide film and manufactured under a predetermined condition, and in the -BT stress state the gate is supplied with an arbitrary negative constant voltage V_(G) and held at a predetermined constant temperature T based on following expressions: ##EQU32## where ΔV_(th) represents threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under said prescribed manufacturing condition, t time, α time coefficient, q elementary electric charge, d voltage coefficient, k Boltzman constant, t_(ox) thickness of the gate oxide film, ΔV_(th)τ tolerant threshold voltage shift amount for said jumbo TFT, μ and σ mean value and standard deviation, respectively, of the threshold voltage shift amounts of the plurality of TFTs manufactured under said prescribed manufacturing condition, m a constant, and β=1/α, the machine executable software procedure comprising the steps ofdetermining time coefficient a in expression (2a) based on a relation between time t and threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test; determining voltage coefficient d in expression (3a) based on a relation between gate voltage V_(G) and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests using different gate voltages; determining a proportional coefficient ##EQU33## by using determined time coefficient α and voltage coefficient d in expression (5b) obtained from a relation between expressions (2a) and (3a); and calculating life τ of a single TFT manufactured under said prescribed manufacturing condition by using an expression (8b) obtained by substituting ΔV_(th)τ /(1+m|σ/μ|) for ΔV_(th)τ in expression (7b) for calculating life τ₀ of the jumbo TFT which expression is obtained by converting expression (5b) from the determined proportional coefficient c₂ and the tolerant threshold voltage shift amount ΔV_(th)τ of the jumbo TFT.
 4. The machine-readable medium according to claim 3, wherein the machine executable software procedure further comprises the steps of:in -BT stress test for a TFT (a) manufactured under a first manufacturing condition and a TFT (b) manufactured under a second manufacturing condition, calculating threshold voltage shift amounts ΔV_(tha) and ΔV_(thb) of a jumbo TFT (a) and a jumbo TFT (b) under a condition where temperature T and gate electric field V_(G) /t_(ox) at a certain time point t are the same; replacing ΔV_(th0) in equation (7b) calculated for said jumbo TFT (a) by ΔV_(th0) ·ΔV_(thb) /ΔV_(tha) and replacing ΔV_(th)τ by ΔV_(th)τ /(1+m|σ/μ|) by using mean value μ and standard deviation σ of the threshold voltage shift amount of either one of a plurality of said TFTs (a) and a plurality of said TFTs (b) to obtain an equation (8c) below: ##EQU34## and using the equation (8a) , estimating life τ of a single said TFT (b).
 5. A machine-readable medium storing a machine executable software procedure for evaluating the reliability of a TFT in a -BT stress state, the TFT having a channel layer formed of a polycrystalline thin film and a gate insulating film of silicon oxide film and manufactured under a predetermined condition, and in the -BT stress state the gate is supplied with an arbitrary negative constant voltage V_(G) and held at an arbitrary constant temperature T using following expressions: ##EQU35## where ΔV_(th) represents threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under said prescribed manufacturing condition, t time, α time coefficient, k Boltzman constant, φ_(E) temperature coefficient, ΔV_(th)τ tolerant threshold voltage shift amount of the TFT, μ and σ mean value and standard deviation, respectively, of threshold voltage shift amounts of the plurality of TFTs manufactured under said prescribed manufacturing condition, m a constant and β=1/α, the machine executable software procedure comprising the steps ofdetermining time coefficient α in equation (2a) based on a relation between time t and threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test; determining temperature coefficient φ_(E) in expression (4b) based on a relation between temperature T and the threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests at different temperatures T; determining proportional constant ##EQU36## using determined time coefficient α and temperature coefficient φ_(E) in expression (5c) obtained from a relation between expressions (2a) and (4b) ; and calculating life τ of a single TFT manufactured under said prescribed manufacturing condition by using expression (8d) obtained by substituting ΔV_(th)τ /(1+m|σ/μ|) for ΔV_(th)τ with respect to (7c) for calculating life τ₀ of jumbo TFT obtained by converting expression (5c) based on the determined proportional coefficient c₂ and tolerant threshold voltage shift amount ΔV_(th)τ of the TFT.
 6. The machine-readable medium according to claim 5, wherein the machine executable software procedure further comprises the steps of:in -BT stress test for a TFT (a) manufactured under a first manufacturing condition and a TFT (b) manufactured under a second manufacturing condition, calculating threshold voltage shift amounts ΔV_(tha) and ΔV_(thb) of a jumbo TFT (a) and a jumbo TFT (b) under a condition where temperature T and gate electric field V_(G) /t_(ox) at a certain time point t are the same; replacing ΔV_(th0) in equation (7c) calculated for said jumbo TFT (a) by ΔV_(th0) ·ΔV_(thb) /ΔV_(tha) and replacing ΔV_(th)τ by ΔV_(th)τ /(1+m|σ/μ|) by using mean value μ and standard deviation σ of the threshold voltage shift amount of either one of a plurality of said TFTs (a) and a plurality of said TFTs (b) to obtain an equation (8e) below: ##EQU37## and using the equation (8e), estimating life τ of a single said TFT (b).
 7. A machine-readable medium storing a machine executable software procedure for evaluating the reliability of a TFT in a -BT stress state, the TFT having a channel layer formed of a polycrystalline thin film and a gate insulating film of silicon oxide film and manufactured under a predetermined condition, and in the -BT stress state the gate is supplied with an arbitrary negative constant voltage V_(G) and maintained at an arbitrary constant temperature T, using the following expressions: ##EQU38## where ΔV_(th) represents threshold voltage shift amount of a jumbo TFT including a plurality of TFTs connected parallel to each other and manufactured under said prescribed manufacturing condition, t time, α time coefficient, q elementary electric charge, d voltage coefficient, k Boltzman constant, t_(ox) thickness of the gate oxide film, φ₀ time coefficient, N_(DR) and P_(H) dangling bond density and ratio of hydrogenation of silicon atoms in said polycrystalline thin film, m₁ and m₂ proportional constants, ΔV_(th0i) and ΔV_(thi) initial threshold voltage and threshold voltage shift amount in a single TFT manufactured under prescribed manufacturing condition, V_(ths) initial threshold voltage of an SOI-MOSFET having same size and shape as the TFT, ξ degree of dissociation of Si--H coupling, C_(ox) capacitance of gate insulating film, n_(db) (x, ε) and p_(h) (x, ε) dangling bond density and ratio of hydrogenation, respectively, per unit energy and per unit volume at a position having energy potential ε with reference to an intrinsic Fermi level at a depth x from the surface of the channel layer, f (ε) Fermi distribution function, φ (x, φ_(s)) potential at position x when surface potential is φ_(s), t_(p) thickness of said polycrystalline silicon thin film, Δφ_(s) amount of change in surface potential of the TFT reaching the threshold voltage condition from flat bond condition, and t_(s) a constant, the machine executable software procedure comprising the steps ofdetermining time coefficient α in expression (2a) based on a relation between time t and the threshold voltage shift amount ΔV_(th) obtained from at least one -BT stress test; determining voltage coefficient d in expression (3a) based on a relation between gate voltage V_(G) and threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests using different gate voltages V_(G) ; determining temperature coefficient φ₀, in equation (4a) based on a relation between temperature T and threshold voltage shift amount ΔV_(th) obtained from at least two -BT stress tests at different temperatures T; and calculating said dangling bond density N_(DB) and said ratio of hydrogenation P_(H) from expressions (9) to (13) using the determined time coefficient α, voltage coefficient d and temperature coefficient φ₀.
 8. The machine-readable medium according to claim 7, wherein thesaid equations (11) and (12) are replaced by respective approximation equations (18) and (19) ##EQU39## where E_(G) represents energy band gap in said polycrystalline silicon thin film.
 9. The machine-readable medium of claim 1, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 10. The machine-readable medium of claim 2, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 11. The machine-readable medium of claim 5, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 12. The machine-readable medium of claim 4, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 13. The machine-readable medium of claim 5, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 14. The machine-readable medium of claim 6, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 15. The machine-readable medium of claim 7, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip.
 16. The machine-readable medium of claim 8, wherein said machine-readable medium is one of a floppy disk, CD-ROM and ROM chip. 